Chong Leong Gan

Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years

Chong Leong Gan, U. Hashim · Journal of Materials Science Materials in Electronics · 2015 · 59 citations

Materials Science, Semiconductors, Electrical Engineering +9

Prognostics and Health Management of Electronics: Fundamentals, MachineLearning, and the Internet of Things

Chong Leong Gan · Life Cycle Reliability and Safety Engineering · 2020 · 55 citations

Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

Chong Leong Gan, EK Ng, B. L. Chan et al. · Journal of Nanomaterials · 2012 · 48 citations · Full text

Engineering, Nanoelectronics Device Packaging, Bondpad Cratering +22

Extended reliability of gold and copper ball bonds in microelectronic packaging

Chong Leong Gan, Classe Francis, Bak Lee Chan et al. · Gold bulletin · 2013 · 45 citations · Full text

Engineering, Copper Ball Bonds, Interconnect (Integrated Circuits) +20

Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

Chong Leong Gan, EK Ng, B. L. Chan et al. · Journal of Nanomaterials · 2013 · 29 citations · Full text

Pdcu Wires, Imc Growth, Engineering +17