Concepedia

Bak Lee Chan

BL

Statistics

Publications

2

Citations

72

H-Index

2

Active since

2013

Affiliations

Universiti Malaysia Perlis(Current)

Penang Development Corporation

Bak Lee Chan is an author at Universiti Malaysia Perlis specializing in electronic packaging, applied physics, and electrical insulation.

Top concepts

EngineeringMicrostructureApplied PhysicsMaterial ScienceElectronic PackagingElectrical InsulationPlasticityReliabilitySolid MechanicsFailure Analysis

Publications per year

2013–2014

2

Publications

2

Extended reliability of gold and copper ball bonds in microelectronic packaging

Chong Leong Gan, Classe Francis, Bak Lee Chan et al. · Gold bulletin · 2013 · 45 citations · Full text

Engineering, Copper Ball Bonds, Interconnect (Integrated Circuits) +20

Evolution and investigation of copper and gold ball bonds in extended reliability stressing

Chong Leong Gan, Bak Lee Chan, U. Hashim · Gold bulletin · 2014 · 27 citations · Full text

Engineering, Severe Plastic Deformation, Mechanical Engineering +21

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