H. Meynen

Properties of porous HSQ-based films capped by plasma enhanced chemical vapor deposition dielectric layers

Francesca Iacopi, Mikhaı̈l R. Baklanov, Erik Sleeckx et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2002 · 29 citations

Materials Engineering, Materials Science, Chemical Engineering +15

Permittivity and Conductivity of Low-Dielectric-Constant SiOC:H Films Deposited by Plasma-Enhanced Chemical Vapor Deposition

P. Gonon, Alain Sylvestre, H. Meynen et al. · Journal of The Electrochemical Society · 2003 · 28 citations

Engineering, Thin Film Process Technology, Silicon On Insulator +18

Low cost, room temperature debondable spin-on temporary bonding solution: A key enabler for 2.5D/3D IC packaging

Ranjith John, H. Meynen, Sheng Wang et al. · 2013 · 17 citations

Engineering, Chemistry, Temporary Bonding Solution +22

Ultra low stress and low temperature patternable silicone materials for applications within microelectronics

H. Meynen, Mathieu Vanden Bulcke, Mario González et al. · Microelectronic Engineering · 2004 · 15 citations

Materials Engineering, Materials Science, Wafer Scale Processing +10

Integration of a low stress photopatternable silicone into a wafer level package

G. Gardner, Brian R. Harkness, E. Ohare et al. · 2004 · 15 citations

Optical Materials, Engineering, Device Integration +21