Zhong-Jie Hong

Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layer

Zhong-Jie Hong, Demin Liu, Hanwen Hu et al. · Applied Surface Science · 2022 · 71 citations

Natural Sciences, Materials Engineering, Materials Science +13

Investigation of Low-Temperature Cu–Cu Direct Bonding With Pt Passivation Layer in 3-D Integration

Demin Liu, Tsung-Yi Kuo, Yuwei Liu et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 50 citations

Engineering, Electrical Engineering, Materials Science +17

Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration

Zhong-Jie Hong, Demin Liu, Hanwen Hu et al. · Applied Surface Science · 2022 · 37 citations

Engineering, Electrical Engineering, Materials Science +14

Development of low-temperature bonding platform using ultra-thin area selective deposition for heterogeneous integration

Mu-Ping Hsu, Chi‐Yu Chen, Hsin-Chi Chang et al. · Applied Surface Science · 2023 · 17 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Scheme for Multi-Chiplet Integration With Low Thermal Budget by Asymmetric Cu-Cu Bonding With Au Passivation Bonding Structure

Zhong-Jie Hong, Ming-Wei Weng, Chih-Han Chen et al. · IEEE Electron Device Letters · 2023 · 16 citations

Engineering, Materials Engineering, Materials Science +17