Mu-Ping Hsu

Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration

Zhong-Jie Hong, Demin Liu, Hanwen Hu et al. · Applied Surface Science · 2022 · 37 citations

Engineering, Electrical Engineering, Materials Science +14

Development of low-temperature bonding platform using ultra-thin area selective deposition for heterogeneous integration

Mu-Ping Hsu, Chi‐Yu Chen, Hsin-Chi Chang et al. · Applied Surface Science · 2023 · 17 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Scheme for Multi-Chiplet Integration With Low Thermal Budget by Asymmetric Cu-Cu Bonding With Au Passivation Bonding Structure

Zhong-Jie Hong, Ming-Wei Weng, Chih-Han Chen et al. · IEEE Electron Device Letters · 2023 · 16 citations

Engineering, Materials Engineering, Materials Science +17

Enhancement of Low-Temperature Cu-Cu Bonding by Metal Alloy Passivation in Ambient Atmosphere

Mu-Ping Hsu, Chih-Han Chen, Zhong-Jie Hong et al. · IEEE Electron Device Letters · 2024 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +16