P.R. Besser

Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment

Arief Suriadi Budiman, Christine Hau-Riege, Won-Chong Baek et al. · Journal of Electronic Materials · 2010 · 46 citations · Full text

Simulation and Experiments of Stress Migration for Cu/low-k BEoL

C.J. Zhai, Heng Yao, A. Marathe et al. · IEEE Transactions on Device and Materials Reliability · 2004 · 37 citations

Engineering, Mechanical Engineering, Line Width +19

Stress modeling of Cu/low-k BEoL - application to stress migration

C.J. Zhai, Heng Yao, P.R. Besser et al. · 2004 · 29 citations

Engineering, Mechanical Engineering, Residual Stress +23

The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines

D. D. Brown, John E. Sanchez, P.R. Besser et al. · MRS Proceedings · 1995 · 10 citations

Materials Science, Confined Metal Lines, Electromigration Technique +13