C.J. Zhai - Concepedia

Author

C.J. Zhai

Also Known As

C.J. Zhai, Changming Zhai

Publications

182

Citations

H-Index

Concepts

All Affiliations

C.J. Zhai is an author at Advanced Micro Devices (United States) specializing in mechanics of materials, electronic packaging, and solid mechanics.

#	Concept	H-Index	Publications	Citations
1	Engineering	6	6	165
2	Materials Science	5	5	117
3	Mechanical Engineering	5	5	137
4	Electrical Engineering	3	3	114
5	Materials Engineering	2	2	66

C.J. Zhai

Publications

165

Citations

H-Index

Page 1

	Year	Citations
Board level solder reliability versus ramp rate and dwell time during temperature cycling C.J. Zhai, Sidharth, Richard C. Blish IEEE Transactions on Device and Materials Reliability Ramp RateEngineeringMechanical EngineeringMechanics Of MaterialsDwell Time	2003	48
Simulation and Experiments of Stress Migration for Cu/low-k BEoL C.J. Zhai, Heng Yao, A. Marathe, IEEE Transactions on Device and Materials Reliability EngineeringMechanical EngineeringLine WidthMetal Line WidthReliability Engineering	2004	37
Stress modeling of Cu/low-k BEoL - application to stress migration C.J. Zhai, Heng Yao, P.R. Besser, EngineeringMechanical EngineeringResidual StressLine WidthReliability Engineering	2004	29
Investigation and Minimization of Underfill Delamination in Flip Chip Packages C.J. Zhai, Sidharth, R.C. BlishII, IEEE Transactions on Device and Materials Reliability Materials ScienceFlip Chip3D Ic ArchitectureChip-scale PackageEngineering	2004	28
Impact of Underfill Fillet Geometry on Interfacial Delamination in Organic Flip Chip Packages Ankit Dubey, C.J. Zhai, Richard C. Blish Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip On Board	2006	12
Board level solder reliability vs. ramp rate & dwell time during temperature cycling C.J. Zhai, Sidharth, Richard C. Blish Ramp RateEngineeringMechanical EngineeringMechanics Of MaterialsDwell Time	2003	11

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