Concepedia

C.J. Zhai

CZ

Statistics

Publications

6

Citations

165

H-Index

6

Active since

2003

Affiliations

Advanced Micro Devices (United States)(Current)

C.J. Zhai is an author at Advanced Micro Devices (United States) specializing in mechanics of materials, electronic packaging, and solid mechanics.

Top concepts

EngineeringSolid MechanicsElectronic PackagingMechanics Of MaterialsMaterial ScienceMechanical EngineeringMicroelectronicsReliability EngineeringElectrical EngineeringReliability

Publications per year

2003–2006

6

Publications

6

Board level solder reliability versus ramp rate and dwell time during temperature cycling

C.J. Zhai, Sidharth, Richard C. Blish · IEEE Transactions on Device and Materials Reliability · 2003 · 48 citations

Ramp Rate, Engineering, Mechanical Engineering +23

Simulation and Experiments of Stress Migration for Cu/low-k BEoL

C.J. Zhai, Heng Yao, A. Marathe et al. · IEEE Transactions on Device and Materials Reliability · 2004 · 37 citations

Engineering, Mechanical Engineering, Line Width +19

Stress modeling of Cu/low-k BEoL - application to stress migration

C.J. Zhai, Heng Yao, P.R. Besser et al. · 2004 · 29 citations

Engineering, Mechanical Engineering, Residual Stress +23

Investigation and Minimization of Underfill Delamination in Flip Chip Packages

C.J. Zhai, Sidharth, R.C. BlishII et al. · IEEE Transactions on Device and Materials Reliability · 2004 · 28 citations

Materials Science, Flip Chip, 3D Ic Architecture +13

Impact of Underfill Fillet Geometry on Interfacial Delamination in Organic Flip Chip Packages

Ankit Dubey, C.J. Zhai, Richard C. Blish · 2006 · 12 citations

Materials Science, Chip-scale Package, Engineering +14

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