Fumiyoshi Kawashiro

Fan-Out Wafer-Level Packaging with highly flexible design capabilities

Yoichiro Kurita, Takehiro Kimura, K. Shibuya et al. · 2010 · 51 citations

Engineering, Computer Architecture, Flexible Design Capabilities +17

Contributions of Nuclear Size and Shape, Nuclear Mass, and Nuclear Spin to Enrichment Factors of Zinc Isotopes in a Chemical Exchange Reaction by a Cryptand

Kazushige Nishizawa, Yoshihisa Maeda, Fumiyoshi Kawashiro et al. · Separation Science and Technology · 1998 · 33 citations

Engineering, Trace Element Geochemistry, Zinc Isotopes +24

Effect of copper over-pad metallization on reliability of aluminum wire bonds

Fumiyoshi Kawashiro, Kentaro Takao, Tatsuya Kobayashi et al. · Microelectronics Reliability · 2019 · 13 citations · Full text

Engineering, Thermal Properties, Interconnect (Integrated Circuits) +28

Investigation of Formation and Growth Behavior of Cu/Al Intermetallic Compounds during Isothermal Aging

Omid Mokhtari, Min‐Su Kim, Hiroshi Nishikawa et al. · Transactions of The Japan Institute of Electronics Packaging · 2014 · 11 citations · Full text

Imc Layers, Imc Growth, Engineering +21