T. Tamaru

Cu-ion-migration phenomena and its influence on TDDB lifetime in Cu metallization

J. Noguchi, Natsuko Miura, M. Kubo et al. · 2003 · 39 citations

Engineering, Electrical Engineering, Materials Science +17

Process and Reliability of Air-Gap Cu Interconnect Using 90-nm Node Technology

J. Noguchi, K. Sato, N. Konishi et al. · IEEE Transactions on Electron Devices · 2005 · 35 citations

Engineering, Electrical Engineering, Materials Science +17

Crystal Direction of CdS Thin Film Produced by Laser Ablation

Hisashi Sakai, T. Tamaru, Tsunetaka Sumomogi et al. · Japanese Journal of Applied Physics · 1998 · 33 citations

Natural Sciences, Materials Engineering, Materials Science +15

Improvement of thermal stability of via resistance in dual damascene copper interconnection

Taku Oshima, T. Tamaru, Kazuyuki Ohmori et al. · 2002 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +14

A novel 0.20 μm full CMOS SRAM cell using stacked cross couple with enhanced soft error immunity

Fumio Ootsuka, Makoto Nakamura, T. Miyake et al. · 2002 · 14 citations

Engineering, Computer Engineering, Electrical Engineering +17