Christopher Jezewski

Author

Intel (United States)

Also Known As

C. Jezewski, Christopher J Jezewski, Christopher J. Jezewski, Christopher Jezewski, Jezewski, Christopher

Publications

617

Citations

H-Index

Concepts

All Affiliations

Intel (United States)Rensselaer Polytechnic Institute University at Albany, State University of New York University of Virginia National Institute of Standards and Technology

About

Christopher Jezewski is an author at Intel (United States) specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	16	549
2	Applied Physics	11	11	410
3	Chemical Engineering	5	5	215
4	Chemistry	5	5	148
5	Health Sciences	1	1	12

Christopher Jezewski

Publications

575

Citations

H-Index

Page 1

	Year	Citations
Substrate‐Independent Palladium Atomic Layer Deposition Jay J. Senkevich, Fu Tang, David J. Rogers, Chemical Vapor Deposition Materials ScienceEngineeringNanomaterialsSurface ChemistrySurface Science	2003	74
Non-Volatile RRAM Embedded into 22FFL FinFET Technology O. Golonzka, Ümüt Arslan, Peng Bai, Non-volatile MemoryEngineeringKey SpecificationsFinfet TechnologyEmerging Memory Technology	2019	71
Plasma-Assisted Atomic Layer Deposition of Palladium Gregory A. Ten Eyck, Jay J. Senkevich, Fu Tang, Chemical Vapor Deposition Materials ScienceSurface CharacterizationChemical EngineeringRemote PlasmaEngineering	2005	66
Low temperature chemical vapor deposition of Co thin films from Co2(CO)8 D.-X. Ye, Samuk Pimanpang, Christopher Jezewski, Thin Solid Films Materials ScienceChemical EngineeringEngineeringSurface ScienceApplied Physics	2005	66
Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces Christopher Jezewski, W. A. Lanford, Christopher J. Wiegand, Journal of The Electrochemical Society EngineeringSaturation CurvesChemical DepositionPlasma ProcessingChemical Engineering	2005	40
Process technology scaling in an increasingly interconnect dominated world James S. Clarke, Christopher George, Christopher Jezewski, EngineeringInterconnect (Integrated Circuits)Physical Design (Electronics)Advanced Packaging (Semiconductors)Nanoelectronics	2014	40
Evaluating size effects on the thermal conductivity and electron-phonon scattering rates of copper thin films for experimental validation of Matthiessen’s rule Md. Rafiqul Islam, Pravin Karna, John A. Tomko, Nature Communications EngineeringMetallic NanomaterialsThermal ConductivityThermal ConductionMaterials Science	2024	34
Molecular Caulking Christopher Jezewski, Christopher J. Wiegand, Dexian Ye, Journal of The Electrochemical Society Materials ScienceChemical EngineeringDielectric ConstantEngineeringNanoengineering	2004	25
Interface and layer periodicity effects on the thermal conductivity of copper-based nanomultilayers with tungsten, tantalum, and tantalum nitride diffusion barriers Claudia Cancellieri, Ethan A. Scott, Jeffrey L. Braun, Journal of Applied Physics Materials ScienceEngineeringCopper-based NanomultilayersNanomaterialsNanotechnology	2020	24
Atomic Layer Deposition of Pd on TaN for Cu Electroless Plating Young Soon Kim, Gregory A. Ten Eyck, Dexian Ye, Journal of The Electrochemical Society Materials ScienceMaterials EngineeringChemical EngineeringCu ElectrolessEngineering	2005	18

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