S. Vanhaelemeersch

Comparative study of SiOCH low-<i>k</i> films with varied porosity interacting with etching and cleaning plasma

Denis Shamiryan, Mikhaı̈l R. Baklanov, S. Vanhaelemeersch et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2002 · 150 citations

Natural Sciences, Materials Engineering, Materials Science +17

Characterization of Cu surface cleaning by hydrogen plasma

Mikhaı̈l R. Baklanov, Denis Shamiryan, Zs. Tôkei et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2001 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effects of oxygen and fluorine on the dry etch characteristics of organic low-<i>k</i> dielectrics

Mikhaı̈l R. Baklanov, S. Vanhaelemeersch, H. Bender et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1999 · 64 citations

Natural Sciences, Materials Engineering, Materials Science +17

Absolute rate constant measurements of fluoromethylidyne (X2.PI.) reactions. 1. Reactions with oxygen, fluorine, chlorine and nitric oxide

Jozef Peeters, Jan Van Hoeymissen, S. Vanhaelemeersch et al. · The Journal of Physical Chemistry · 1992 · 43 citations

Natural Sciences, Chemistry, Analytical Chemistry +5

Removal of Plasma-Modified Low-k Layer Using Dilute HF: Influence of Concentration

Quoc Toan Le, Mikhaı̈l R. Baklanov, E. Kesters et al. · Electrochemical and Solid-State Letters · 2005 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +16