M. B. Zhou

Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints

H. Qin, X.P. Zhang, M. B. Zhou et al. · Materials Science and Engineering A · 2014 · 52 citations

Materials Science, Materials Engineering, Friction Welding +12

Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects

XinTao Li, Jiutian Xia, M. B. Zhou et al. · Journal of Electronic Materials · 2011 · 47 citations

Materials Science, Engineering, Mechanical Engineering +6

Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints

H. Qin, Xin-Ran Zhang, M. B. Zhou et al. · Microelectronics Reliability · 2015 · 43 citations

Materials Science, Engineering, Mechanical Engineering +6

Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient

Shuibao Liang, Chang-Bo Ke, Jiaqiang Huang et al. · Microelectronics Reliability · 2018 · 31 citations

Materials Science, Thermomigration-induced Phase Segregation, Electromigration Technique +10

Superior strength and strengthening mechanism of die attachment joints by using bimodal-sized Cu nanoparticle paste capable of low-temperature pressureless sintering

Hui Huang, Xin Wu, M. B. Zhou et al. · Journal of Materials Science Materials in Electronics · 2021 · 20 citations

Materials Science, Materials Engineering, Superior Strength +9