Publication | Closed Access
Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects
47
Citations
39
References
2011
Year
Materials ScienceEngineeringMechanical EngineeringShear Fracture BehaviorSolder Volume EffectsMicrostructure EvolutionElectronic PackagingMechanics Of MaterialsMicrostructure
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