Xin-Ran Zhang - Concepedia

Author

Xin-Ran Zhang

South China University of Technology

Also Known As

X. P. Zhang, X.P. Zhang, Xin-Ran Zhang, Xinran Zhang

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

South China University of Technology University of Electronic Science and Technology of China The University of Tokyo Peking University City University of Hong Kong

About

Xin-Ran Zhang is an author at South China University of Technology specializing in engineering, materials science, and microstructure.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	17	803
2	Applied Physics	7	7	377
3	Natural Sciences	1	1	26
4	Biomedical Engineering	1	1	105
5	Chemical Engineering	1	1	15

Xin-Ran Zhang

Publications

994

Citations

H-Index

Page 1

	Year	Citations
Tailoring MOF-based materials to tune electromagnetic property for great microwave absorbers and devices Jin‐Cheng Shu, Xinyu Yang, Xin-Ran Zhang, Carbon Materials ScienceEngineeringGreat Microwave AbsorbersElectromagnetic PropertyMof-based Materials	2020	240
Wearable multi-sensing double-chain thermoelectric generator Dan-Liang Wen, Haitao Deng, Xin Liu, Microsystems & Nanoengineering	2020	111
Silk Fibroin-Based Wearable All-Fiber Multifunctional Sensor for Smart Clothing Dan-Liang Wen, Yu-Xing Pang, Peng Huang, Advanced Fiber Materials Smart TextileEngineeringMultimaterial FiberSmart ClothingWearable Technology	2022	105
Super-stretchable multi-sensing triboelectric nanogenerator based on liquid conductive composite Haitao Deng, Xin-Ran Zhang, Zhiyong Wang, Nano Energy Materials ScienceLiquid Conductive CompositeEngineeringPiezoelectric NanogeneratorsNanomaterials	2021	82
A comparative study of the porous TiNi shape-memory alloys fabricated by three different processes Bin Yuan, Xin-Ran Zhang, M. Zhu, Metallurgical and Materials Transactions A Materials EngineeringMaterials ScienceEngineeringNanoporous MaterialMechanical Engineering	2006	54
Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects XinTao Li, Jiutian Xia, M. B. Zhou, Journal of Electronic Materials Materials ScienceEngineeringMechanical EngineeringShear Fracture BehaviorSolder Volume Effects	2011	47
Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints H. Qin, Xin-Ran Zhang, M. B. Zhou, Microelectronics Reliability Materials ScienceEngineeringMechanical EngineeringMicrostructure-strength RelationshipFracture Behavior	2015	43
Self-powered trajectory-tracking microsystem based on electrode-miniaturized triboelectric nanogenerator Yan-Yuan Ba, Jingfu Bao, Zhiyong Wang, Nano Energy Electrical EngineeringEnergy HarvestingEngineeringMicrofabricationPiezoelectric Nanogenerators	2020	41
Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures Xin-Ran Zhang, Changxing Yu, Suman Shrestha, Journal of Materials Science Materials in Electronics Materials ScienceMaterials EngineeringLead-free Sn–ag–cu–biEngineeringSn60pb40 Solder Interconnections	2006	30
Thermal creep and fracture behaviors of the lead-free Sn–Ag–Cu–Bi solder interconnections under different stress levels Xin-Ran Zhang, Limeng Yin, Changxing Yu Journal of Materials Science Materials in Electronics Materials ScienceEngineeringSevere Plastic DeformationThermal CreepMechanical Engineering	2007	30

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