Shuibao Liang

Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient

Shuibao Liang, Chang-Bo Ke, Jiaqiang Huang et al. · Microelectronics Reliability · 2018 · 31 citations

Materials Science, Thermomigration-induced Phase Segregation, Electromigration Technique +10

Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite

Han Jiang, Stuart Robertson, Shuibao Liang et al. · Materials Today Communications · 2022 · 17 citations · Full text

Bonding Process, Engineering, Mechanical Engineering +23

Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects

Shuibao Liang, Chang-Bo Ke, Weishi Ma et al. · Microelectronics Reliability · 2017 · 16 citations

Electrical Engineering, Electromigration Technique, Engineering +11

Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature

Jiaqiang Huang, Min-Bo Zhou, Shuibao Liang et al. · Journal of Materials Science Materials in Electronics · 2018 · 16 citations

Materials Science, Materials Engineering, Interfacial Reaction +12

Insight into the preferential grain growth of intermetallics under electric current stressing – A phase field modeling

Shuibao Liang, Anil Kunwar, Cheng Wei et al. · Scripta Materialia · 2021 · 16 citations

Phase Field, Electrical Engineering, Engineering +6