Clair Webb

Die Stacking (3D) Microarchitecture

Bryan Black, Daniel Pantuso, Paul A. Reed et al. · 2006 · 598 citations

Hardware Security, 3D Ic Architecture, Electrical Engineering +13

3D processing technology and its impact on iA32 microprocessors

Bryan Black, Donald W. Nelson, Clair Webb et al. · 2004 · 168 citations

Engineering, Computer Architecture, 3D Modeling +18

Wordline & Bitline Pulsing Schemes for Improving SRAM Cell Stability in Low-Vcc 65nm CMOS Designs

Muhammad Khellah, Y. Ye, N. Kim et al. · 2006 · 85 citations

Electrical Engineering, Engineering, Vlsi Design +13

Design and Fabrication of 3D Microprocessors

Patrick Morrow, Bryan Black, M. Kobrinsky et al. · MRS Proceedings · 2006 · 46 citations

3D Ic Architecture, Engineering, Microfabrication +6

Design and validation of the Pentium/sup /spl reg// III and Pentium/sup /spl reg// 4 processors power delivery

T. Rahal-Arabi, G. Taylor, Ming Ma et al. · 2003 · 37 citations

Engineering, Vlsi Design, Power Optimization (Eda) +17