Baron Huang

Publications

Citations

H-Index

2015

Active since

Affiliations

Industrial Technology Research Institute(Current)

National Yang Ming Chiao Tung University

Brewer Science (United States)

Baron Huang is an author at Industrial Technology Research Institute specializing in polymer chemistry, advanced packaging, and mechanical engineering.

Top concepts

EngineeringApplied PhysicsPolymer ScienceMaterial ScienceMicroelectronicsMicrofabricationPolymer ChemistryAdvanced PackagingIntegrated CircuitsElectronic Packaging

Publications per year

2015–2022

Publications

A hybrid bonding interconnection with a novel low-temperature bonding polymer system

Yu-Min Lin, Po-Chih Chang, Ou-Hsiang Lee et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 15 citations

Engineering, Mechanical Engineering, Integrated Circuits +28

Study of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-First and Die-First Fan-Out Wafer-Level Packaging (FOWLP)

Chia‐Hsin Lee, Baron Huang, Jennifer See et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 13 citations

Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication

Wen-Wei Shen, Hsiang‐Hung Chang, Jen Chun Wang et al. · 2015 · 11 citations

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