Jialing Tong

Electrical Modeling and Analysis of Tapered Through-Package via in Glass Interposers

Jialing Tong, Yoichiro Sato, Kadappan Panayappan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 32 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +18

Design and Demonstration of 2.5D Glass Interposers as a Superior Alternative to Silicon Interposers for 28 Gbps Signal Transmission

Brett Sawyer, Bruce C. S. Chou, Jialing Tong et al. · 2016 · 21 citations

Engineering, Device Integration, Gbps Signal Transmission +18

First demonstration of reliable copper-plated 30μm diameter through-package-vias in ultra-thin bare glass interposers

Kaya Demir, Andaç Armutlulu, Jialing Tong et al. · 2014 · 20 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +21

Characterization of electrical properties of glass and transmission lines on thin glass up to 50 GHz

Wasif Tanveer Khan, Jialing Tong, Srikrishna Sitaraman et al. · 2015 · 18 citations

Engineering, Microwave Transmission, Thin Glass +16

Substrate-integrated waveguides in glass interposers with through-package-vias

Jialing Tong, Venky Sundaram, Aric Shorey et al. · 2015 · 18 citations

Tpv Pitch, Optical Materials, Engineering +16