Kadappan Panayappan

Design and Demonstration of a 2.5-D Glass Interposer BGA Package for High Bandwidth and Low Cost

Brett Sawyer, Yuya Suzuki, Ryuta Furuya et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 45 citations

Engineering, Device Integration, Laser Ablation +18

Electrical Modeling and Analysis of Tapered Through-Package via in Glass Interposers

Jialing Tong, Yoichiro Sato, Kadappan Panayappan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 32 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +18

Design and Demonstration of 2.5D Glass Interposers as a Superior Alternative to Silicon Interposers for 28 Gbps Signal Transmission

Brett Sawyer, Bruce C. S. Chou, Jialing Tong et al. · 2016 · 21 citations

Engineering, Device Integration, Gbps Signal Transmission +18

Numerically efficient method-of-moments formulation valid over a wide frequency band including very low frequencies

Chiara Pelletti, G. Bianconi, R. Mittra et al. · IET Microwaves Antennas & Propagation · 2012 · 15 citations

A universal dipole-moment-based approach for formulating MoM-type problems without the use of Green's functions

R. Mittra, Kadappan Panayappan, Chiara Pelletti et al. · European Conference on Antennas and Propagation · 2010 · 15 citations

Numerical Analysis, Method Of Fundamental Solution, Electrical Engineering +12