Baik-Woo Lee

Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications

Fuhan Liu, Venky Sundaram, Sung-Hwan Min et al. · 2010 · 31 citations

Engineering, Organic Electronics, Integrated Circuits +24

Chip-last Embedded Active for System-On-Package (SOP)

Baik-Woo Lee, Venky Sundaram, B. Wiedenman et al. · 2007 · 30 citations

Engineering, Computer Architecture, Embedded Systems +17

Leakage current analysis of hydrothermal BaTiO3 thin films

P. Markondeya Raj, Baik-Woo Lee, D. Balaraman et al. · Journal of Electroceramics · 2011 · 18 citations

Leakage Current Analysis, Engineering, Oxide Electronics +2

New 3-D Chip Stacking Architectures by Wire-On-Bump and Bump-On-Flex

Baik-Woo Lee, Jui-Yun Tsai, Hotae Jin et al. · IEEE Transactions on Advanced Packaging · 2008 · 17 citations

3D Ic Architecture, Electrical Engineering, Engineering +13

Micromechanism of local brittle zone phenomenon in weld heat-affected zones of advanced 9% Ni steel

Jae‐il Jang, Jang-Bog Ju, Baik-Woo Lee et al. · Journal of Materials Science Letters · 2001 · 12 citations