Rongfeng Luo

Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices

Jun Yan, Shenglin Ma, Yufeng Jin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 33 citations

Engineering, Electrical Engineering, Materials Science +17

Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology

Shenglin Ma, Yanming Xia, Yaohua Wang et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2016 · 18 citations

Engineering, Materials Engineering, Materials Science +15

Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

Han Cai, Jun Yan, Shenglin Ma et al. · Journal of Micromechanics and Microengineering · 2019 · 14 citations

Engineering, Materials Engineering, Materials Science +16