Concepedia

Han Cai

HC

Statistics

Publications

3

Citations

66

H-Index

3

Active since

2018

Affiliations

Institute of Microelectronics(Current)

Peking University

Xiamen University

Han Cai is an author at Institute of Microelectronics specializing in integrated circuit fabrication, three-dimensional integration, and engineering.

ORCID

Publications per year

2018–2019

3

Publications

3

Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices

Jun Yan, Shenglin Ma, Yufeng Jin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 33 citations

, , +17

Thermal and Electrical Characterization of TSV Interposer Embedded with Microchannel for 2.5D Integration of GaN RF Devices

Han Cai, Shenglin Ma, Wei Wang et al. · 2018 · 19 citations

, , +17

Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

Han Cai, Jun Yan, Shenglin Ma et al. · Journal of Micromechanics and Microengineering · 2019 · 14 citations

, , +16

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