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Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

3D Ic ArchitectureElectrical EngineeringThrough-glass-via InterposerEngineeringDevice IntegrationAdvanced Packaging (Semiconductors)AntennaApplied PhysicsRadio Frequency IntegrationElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)