Shuwei He

3D self-assembled VS₄ microspheres with high pseudocapacitance as highly efficient anodes for Na-ion batteries

Wenbin Li, Jianfeng Huang, Liangliang Feng et al. · Nanoscale · 2018 · 53 citations

Natural Sciences, Materials Engineering, Materials Science +17

Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices

Jun Yan, Shenglin Ma, Yufeng Jin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 33 citations

Engineering, Electrical Engineering, Materials Science +17

Dual carbon composited with Co9S8 through C-S bond as a high performance Binder-Free anode for Sodium-Ion batteries

Shuwei He, Jianfeng Huang, Jiayin Li et al. · Applied Surface Science · 2022 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +17

A RF Redundant TSV Interconnection for High Resistance Si Interposer

Mengcheng Wang, Shenglin Ma, Yufeng Jin et al. · Micromachines · 2021 · 20 citations · Full text

Engineering, Electrical Engineering, Microelectronics +16

Thermal and Electrical Characterization of TSV Interposer Embedded with Microchannel for 2.5D Integration of GaN RF Devices

Han Cai, Shenglin Ma, Wei Wang et al. · 2018 · 19 citations

Engineering, Electrical Engineering, Materials Engineering +17