Concepedia

Jun Yan

JY

Statistics

Publications

3

Citations

65

H-Index

3

Active since

2018

Affiliations

Peking University(Current)

Institute of Microelectronics

Xiamen University

Jun Yan is an author at Peking University specializing in materials science, integrated circuit fabrication, and engineering.

ORCID

Publications per year

2018–2022

3

Publications

3

Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices

Jun Yan, Shenglin Ma, Yufeng Jin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 33 citations

, , +17

Dry-transferred single-walled carbon nanotube thin films for flexible and transparent heaters

Zhao Zhang, Haohao Dong, Yongping Liao et al. · Surfaces and Interfaces · 2022 · 18 citations

, , +12

Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

Han Cai, Jun Yan, Shenglin Ma et al. · Journal of Micromechanics and Microengineering · 2019 · 14 citations

, , +16

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