Hideyuki Takahara

Preparation and Electrical Properties of Quaternary Ammonium Montmorillonite-Polystyrene Complexes

Chuzo Kato, Kazuyuki Kuroda, Hideyuki Takahara · Clays and Clay Minerals · 1981 · 68 citations

Natural Sciences, Chemistry, Materials Science +14

Fully SMT-compatible optical-I/O package with microlens array interface

Y. Ishii, N. Tanaka, Tadashi Sakamoto et al. · Journal of Lightwave Technology · 2003 · 42 citations

Engineering, Electrical Engineering, Optics +16

Optoelectronic multichip module packaging technologies and optical input/output interface chip-level packages for the next generation of hardware systems

Hideyuki Takahara · IEEE Journal of Selected Topics in Quantum Electronics · 2003 · 30 citations

Engineering, Computer Systems, Electrical Engineering +17

Advanced flip chip bonding techniques using transferred microsolder bumps

Nobutatsu Koshoubu, Suzuko Ishizawa, H. Tsunetsugu et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 20 citations

Engineering, Electrical Engineering, Electronic Materials +16

New optical and electrical hybrid packaging techniques using optical waveguides for optoelectronic multichip modules

Satoshi Koike, Fusao Simokawa, Takeshi Matsuura et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +17