H. Tsunetsugu

10-Gb/s strained MQW DFB-LD transmitter module and superlattice APD receiver module using GaAs MESFET IC's

Y. Miyamoto, K. Hagimoto, M. Ohhata et al. · Journal of Lightwave Technology · 1994 · 39 citations

Photonics, Electrical Engineering, Engineering +10

Flip-chip bonded 0.85-μm bottom-emitting vertical-cavity laser array on an AlGaAs substrate

Yoshitaka Ohiso, Kouta Tateno, Y. Kohama et al. · IEEE Photonics Technology Letters · 1996 · 33 citations

Wide-bandgap Semiconductor, Photonics, Engineering +12

Electronically tunable first-order all-pass circuit employing DVCC and OTA

Takao Tsukutani, H. Tsunetsugu, Yasuaki Sumi et al. · International Journal of Electronics · 2010 · 30 citations

Electrical Engineering, Engineering, Circuit System +9

40 Gbit/s optical receiver module using a flip-chipbonding technique for device interconnection

Y. Miyamoto, M. Yoneyama, Yasuhiko Imai et al. · Electronics Letters · 1998 · 28 citations

A new packaging technology using micro-solder bumps for high-speed photoreceivers

H. Tsunetsugu, K. Katsura, Tsuyoshi Hayashi et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 24 citations

Optical Materials, Engineering, Optical Transmission System +25