Hsing-Hsiang Wang

Monolithic 3D chip integrated with 500ns NVM, 3ps logic circuits and SRAM

Chang‐Hong Shen, Jia‐Min Shieh, Tsung‐Ta Wu et al. · 2013 · 44 citations

Engineering, Computer Engineering, Electrical Engineering +17

Low-cost and TSV-free monolithic 3D-IC with heterogeneous integration of logic, memory and sensor analogy circuitry for Internet of Things

Tsung‐Ta Wu, Chang‐Hong Shen, Jia‐Min Shieh et al. · 2015 · 32 citations

Engineering, Computer Engineering, Electrical Engineering +17

Record-high 121/62 μA/μm on-currents 3D stacked epi-like Si FETs with and without metal back gate

Chih-Chao Yang, Szu-Hung Chen, Jia‐Min Shieh et al. · 2013 · 27 citations

Engineering, Electrical Engineering, Materials Science +17

First fully functionalized monolithic 3D+ IoT chip with 0.5 V light-electricity power management, 6.8 GHz wireless-communication VCO, and 4-layer vertical ReRAM

Fu-Kuo Hsueh, Chang‐Hong Shen, Jia‐Min Shieh et al. · 2016 · 22 citations

Engineering, Computer Engineering, Electrical Engineering +14

Embedded Integration of Sb₂Se₃ Film by Low-Temperature Plasma-Assisted Chemical Vapor Reaction with Polycrystalline Si Transistor for High-Performance Flexible Visible-to-Near-Infrared Photodetector

Ying‐Chun Shen, Cheng-Yu Lee, Hsing-Hsiang Wang et al. · ACS Nano · 2023 · 22 citations

Engineering, Materials Engineering, Materials Science +17