Fu-Kuo Hsueh

Low-Temperature Microwave Annealing Processes for Future IC Fabrication—A Review

Yao‐Jen Lee, Ta-Chun Cho, Shang-Shiun Chuang et al. · IEEE Transactions on Electron Devices · 2014 · 77 citations

Semiconductors, Materials Science, Electrical Engineering +14

Fabrication of Vertically Stacked Nanosheet Junctionless Field-Effect Transistors and Applications for the CMOS and CFET Inverters

Po-Jung Sung, Shu-Wei Chang, Kuo-Hsing Kao et al. · IEEE Transactions on Electron Devices · 2020 · 58 citations

Device Modeling, Cfet Inverter, Electrical Engineering +14

First Demonstration of Heterogeneous IGZO/Si CFET Monolithic 3-D Integration With Dual Work Function Gate for Ultralow-Power SRAM and RF Applications

Shu-Wei Chang, Tsung-Han Lu, Cong-Yi Yang et al. · IEEE Transactions on Electron Devices · 2022 · 45 citations

Engineering, Vlsi Design, Integrated Circuits +20

A novel junctionless FinFET structure with sub-5nm shell doping profile by molecular monolayer doping and microwave annealing

Y.-J. Lee, T.-C. Cho, Kuo-Hsing Kao et al. · 2014 · 41 citations

Semiconductor Technology, Electrical Engineering, Engineering +11

Low-cost and TSV-free monolithic 3D-IC with heterogeneous integration of logic, memory and sensor analogy circuitry for Internet of Things

Tsung‐Ta Wu, Chang‐Hong Shen, Jia‐Min Shieh et al. · 2015 · 32 citations

Monolithic Ic, Engineering, Vlsi Design +20