Tsung‐Ta Wu

Hyperdimensional computing with 3D VRRAM in-memory kernels: Device-architecture co-design for energy-efficient, error-resilient language recognition

Haitong Li, Tony F. Wu, Abbas Rahimi et al. · 2016 · 133 citations

Engineering, Computer Engineering, Computer Science +15

Four-layer 3D vertical RRAM integrated with FinFET as a versatile computing unit for brain-inspired cognitive information processing

Haitong Li, Kai‐Shin Li, Chang-Hsien Lin et al. · 2016 · 70 citations

Engineering, Computer Engineering, Computer Science +9

Monolithic 3D chip integrated with 500ns NVM, 3ps logic circuits and SRAM

Chang‐Hong Shen, Jia‐Min Shieh, Tsung‐Ta Wu et al. · 2013 · 44 citations

Engineering, Computer Engineering, Electrical Engineering +17

Strength, stiffness, and microstructure of Cu(In,Ga)Se2 thin films deposited via sputtering and co-evaporation

Shi Luo, Jiun‐Haw Lee, C. W. Liu et al. · Applied Physics Letters · 2014 · 39 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Toward high efficiency and panel size 30×40 cm2 Cu(In,Ga)Se2 solar cell: Investigation of modified stacking sequences of metallic precursors and pre-annealing process without Se vapor at low temperature

Tsung‐Ta Wu, Jyun-Hong Huang, Fan Hu et al. · Nano Energy · 2014 · 32 citations

Engineering, Materials Engineering, Materials Science +17