Olli Salmela

Acceleration Factors for Lead-Free Solder Materials

Olli Salmela · IEEE Transactions on Components and Packaging Technologies · 2007 · 69 citations

Engineering, Materials Engineering, Materials Science +10

Base Station Energy Use in Dense Urban and Suburban Areas

Jari Huttunen, Matti Pärssinen, Tomi Heikkila et al. · IEEE Access · 2023 · 17 citations · Full text

Computing, Computer Systems, Information Technology +16

BGA Interconnection Reliability in Mirrored Module Configurations

J. Hagberg, Jussi Putaala, Juha Raumanni et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 15 citations

Engineering, Electrical Engineering, Heat Transfer +16

Modified Engelmaier’s model taking account of different stress levels

Olli Salmela, Klas Andersson, Altti Perttula et al. · Microelectronics Reliability · 2008 · 13 citations

Public Health, Behavioral Sciences, Mechanical Behavior Of Materials +5

Carbon Handprint: Potential Climate Benefits of a Novel Liquid-Cooled Base Station with Waste Heat Reuse

Heli Kasurinen, Saija Vatanen, Kaisa Grönman et al. · Energies · 2019 · 12 citations · Full text

Management, Environmental Engineering, Environmental Management +17