Mark Kiehlbauch - Concepedia

Author

Mark Kiehlbauch

University of California, Santa Barbara

Also Known As

M. Kiehlbauch, M. W. Kiehlbauch, Mark Kiehlbauch, Mark W. Kiehlbauch

Publications

565

Citations

H-Index

Concepts

All Affiliations

University of California, Santa Barbara Lam Research (United States)University of California, Berkeley University of Minnesota Micron (United States)

About

Mark Kiehlbauch is an author at University of California, Santa Barbara specializing in engineering, applied physics, and surface science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	13	545
2	Applied Physics	10	10	444
3	Chemical Engineering	4	4	165
4	Chemistry	4	4	173
5	Natural Sciences	1	1	65

Mark Kiehlbauch

Publications

545

Citations

H-Index

Page 1

	Year	Citations
Etching of high aspect ratio structures in Si using SF6/O2 plasma Sergi Gomez, Rodolfo Jun Belen, Mark Kiehlbauch, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films EngineeringIntegrated CircuitsVacuum DeviceSilicon On InsulatorPlasma Processing	2004	96
Modeling argon inductively coupled plasmas: The electron energy distribution function and metastable kinetics Mark Kiehlbauch, David B. Graves Journal of Applied Physics Electron DensityEngineeringPhysicsExperimental MeasurementsPlasma Simulation	2002	66
Inductively coupled plasmas in oxygen: Modeling and experiment Mark Kiehlbauch, David B. Graves Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Cold Atmospheric PlasmaEngineeringPhysicsNatural SciencesPlasma Simulation	2003	65
Feature-scale model of Si etching in SF6∕O2 plasma and comparison with experiments Rodolfo Jun Belen, Sergi Gomez, David Cooperberg, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films EngineeringVacuum DeviceSilicon On InsulatorPlasma ProcessingChemical Engineering	2005	57
Temperature resolved modeling of plasma abatement of perfluorinated compounds Mark Kiehlbauch, David B. Graves Journal of Applied Physics Electrical EngineeringChemical EngineeringEngineeringNonthermal PlasmaPlasma Simulation	2001	52
Feature-scale model of Si etching in SF6 plasma and comparison with experiments Rodolfo Jun Belen, Sergi Gomez, Mark Kiehlbauch, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Feature-scale ModelElectrical EngineeringEngineeringMicrofabricationApplied Physics	2004	47
Etching mechanism of the single-step through-silicon-via dry etch using SF6/C4F8 chemistry Zihao Ouyang, D. N. Ruzic, Mark Kiehlbauch, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films EngineeringSidewall SmoothnessPlasma PhysicsSilicon On InsulatorPlasma Processing	2014	31
Model of point-of-use plasma abatement of perfluorinated compounds with an inductively coupled plasma A. Fiala, Mark Kiehlbauch, Sergej Mahnovski, Journal of Applied Physics Electrical EngineeringChemical EngineeringEngineeringPerfluorinated CompoundsNonthermal Plasma	1999	30
Effect of neutral transport on the etch product lifecycle during plasma etching of silicon in chlorine gas Mark Kiehlbauch, David B. Graves Journal of Vacuum Science & Technology A Vacuum Surfaces and Films EngineeringFluid MechanicsChemistrySilicon On InsulatorPlasma Processing	2002	26
Feature scale model of Si etching in SF6∕O2∕HBr plasma and comparison with experiments Rodolfo Jun Belen, Sergi Gomez, Mark Kiehlbauch, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films EngineeringMicrofabricationSurface KineticsSilicon On InsulatorSurface Science	2006	23

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