Laura Pruette - Concepedia

Author

Laura Pruette

Motorola (United States)

Also Known As

L. C. Pruette, L. Pruette, Laura C. Pruette, Laura Pruette, Pruette, Laura C. (Laura Catherine), 1974-

Publications

211

Citations

H-Index

Concepts

All Affiliations

Motorola (United States)Massachusetts Institute of Technology

About

Laura Pruette is an author at Motorola (United States) specializing in engineering, chemical engineering, and chemistry.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	167
2	Chemical Engineering	7	7	137
3	Chemistry	6	6	126
4	Applied Physics	2	2	43
5	Biomedical Engineering	1	1	30

Laura Pruette

Publications

177

Citations

H-Index

Page 1

	Year	Citations
Evaluation of C[sub 4]F[sub 8]O as an Alternative Plasma-Enhanced Chemical Vapor Deposition Chamber Clean Chemistry Laura Pruette, Simon Karecki, R. Reif, Journal of The Electrochemical Society Environmental ElectrochemistryEngineeringEnergy EfficiencyEnergy ConversionChemistry	2000	33
Lithographic Properties of Poly(<i>tert</i>-butyl methacrylate)-Based Block and Random Copolymer Resists Designed for 193 nm Wavelength Exposure Tools Allen H. Gabor, Laura Pruette, Christopher K. Ober Chemistry of Materials EngineeringElectron-beam LithographySmart PolymerRandom Copolymer ResistsNm Wavelength Imaging	1996	30
Use of Novel Hydrofluorocarbon and Iodofluorocarbon Chemistries for a High Aspect Ratio Via Etch in a High Density Plasma Etch Tool Simon Karecki, Laura Pruette, R. Reif, Journal of The Electrochemical Society Hdp Etch ToolChemical EngineeringFourier TransformEngineeringMicrofabrication	1998	27
Evaluation of trifluoroacetic anhydride as an alternative plasma enhanced chemical vapor deposition chamber clean chemistry Laura Pruette, Simon Karecki, R. Reif, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films EngineeringAlternative PlasmaPfc EmissionsGreen ChemistryOrganic Chemistry	1998	27
Evaluation of Oxalyl Fluoride for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool Simon Karecki, Ritwik Chatterjee, Laura Pruette, Journal of The Electrochemical Society Materials ScienceDielectric Etch ApplicationChemical EngineeringEngineeringElectronic Materials	2001	16
Use of 2H-heptafluoropropane, 1-iodoheptafluoropropane, and 2-iodoheptafluoropropane for a high aspect ratio via etch in a high density plasma etch tool Simon Karecki, Laura Pruette, R. Reif, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films High DensityWafer PatterningElectrical EngineeringChemical EngineeringFourier Transform	1998	13
Evaluation of a Dilute Nitrogen Trifluoride Plasma Clean in a Dielectric PECVD Reactor Laura Pruette Electrochemical and Solid-State Letters Chemical EngineeringEngineeringEnvironmental EngineeringGlobal Warming EmissionsDielectric Pecvd Tool	1999	11
Plasma etching of dielectric films with novel iodofluorocarbon chemistries: Iodotrifluoroethylene and 1-iodoheptafluoropropane Simon Karecki, Laura Pruette, R. Reif Journal of Vacuum Science & Technology A Vacuum Surfaces and Films	1998	10
Evaluation of Pentafluoroethane and 1,1-Difluoroethane for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool Simon Karecki, Ritwik Chatterjee, Laura Pruette, Japanese Journal of Applied Physics Materials ScienceDielectric Etch ApplicationElectrical EngineeringChemical EngineeringEnvironmental Chemistry	2000	10

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