Statistics
Publications
4
Citations
72
H-Index
4
Active since
2009
Andy Heinig is an author at Fraunhofer-Gesellschaft specializing in engineering, image sensors, and 3d integrated circuits.
Publications per year
2009–2015
4
4
3D integration of image sensor SiP using TSV silicon interposer
M. Juergen Wolf, Kai Zoschke, Armin Klumpp et al. · 2009 · 21 citations
Engineering, Automotive Engineering, Systems Engineering +17
3D image sensor SiP with TSV silicon interposer
I. Limansyah, M. J. Wolf, Armin Klumpp et al. · 2009 · 20 citations · Full text
Engineering, Automotive Engineering, Systems Engineering +17
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