Thermal analysis and optimization of 2.5D and 3D integrated systems with Wide I/O memory

Abstract

During the design of 2.5D and 3D integrated systems the thermal management of the whole system is important, especially in high performance systems with combinations of processor and memory dies utilizing the Wide I/O memory interface. Because cooling solutions could be very expensive they should be considered in very early design cycles. For example, the decision if the system is implemented as a real stacked system or using an interposer strongly influences the required cooling solution. Furthermore, high performance systems with data transfer rates in the range of 100 Gbit/s to 400 Gbit/s between processor and memory require an early and fast floorplan calculation to determine and optimize the heat distribution within the system (i.e., dies and package).