Hyo-Soo Lee

Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint

Jeong‐Won Yoon, Bo‐In Noh, Hyo-Soo Lee et al. · Microelectronics Reliability · 2008 · 36 citations

Natural Sciences, Materials Engineering, Materials Science +16

Characterization of direct patterned Ag circuits for RF application

Jong‐Woong Kim, Young‐Chul Lee, Jong‐Min Kim et al. · Microelectronic Engineering · 2009 · 29 citations

Engineering, Electrical Engineering, Materials Science +14

Paternalistic Human Resource Practices: Their Emergence and Characteristics

Hyo-Soo Lee · Journal of Economic Issues · 2001 · 23 citations

Management, Human Resource Management, Organization Studies +11

Fabrication of Ag-MWNT nanocomposite paste for high-power LED package

Kwang‐Seok Kim, Bum-Geun Park, Hong-Sik Kim et al. · Current Applied Physics · 2015 · 19 citations

Natural Sciences, Materials Engineering, Materials Science +10

Analysis of thermo-mechanical behavior of ITO layer on PET substrate

Hyo-Soo Lee, Jae-Oh Bang, Hai-Joong Lee et al. · 2011 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +17