V. Chikarmane

A 22nm high performance and low-power CMOS technology featuring fully-depleted tri-gate transistors, self-aligned contacts and high density MIM capacitors

C. Auth, C. Allen, A. Blattner et al. · 2012 · 758 citations

Engineering, Computer Engineering, Electrical Engineering +16

A 14nm logic technology featuring 2<sup>nd</sup>-generation FinFET, air-gapped interconnects, self-aligned double patterning and a 0.0588 µm<sup>2</sup> SRAM cell size

S. Natarajan, M. Agostinelli, Sheikh A. Akbar et al. · 2014 · 532 citations

Engineering, Computer Engineering, Electrical Engineering +16

A 10nm high performance and low-power CMOS technology featuring 3^rd generation FinFET transistors, Self-Aligned Quad Patterning, contact over active gate and cobalt local interconnects

C. Auth, A. Aliyarukunju, M. Asoro et al. · 2017 · 369 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 90 nm logic technology featuring 50 nm strained silicon channel transistors, 7 layers of Cu interconnects, low k ILD, and 1 μm/sup 2/ SRAM cell

Scott E. Thompson, N. Anand, M Armstrong et al. · 2003 · 243 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 65nm logic technology featuring 35nm gate lengths, enhanced channel strain, 8 Cu interconnect layers, low-k ILD and 0.57 μm/sub 2/ SRAM cell

C. Auth, S. Balakrishnan, M. Bost et al. · 2005 · 230 citations

Engineering, Computer Engineering, Electrical Engineering +17