J. Auersperg

Statistics

Publications

Citations

135

H-Index

Active since

2002

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Fraunhofer Institute for Electronic Nano Systems

J. Auersperg is an author at Fraunhofer Institute for Reliability and Microintegration specializing in electronic packaging, engineering, and materials science.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMicroelectronicsMechanical EngineeringApplied PhysicsMicrofabricationMechanics Of MaterialsFlexible ElectronicsMaterials Engineering

Publications per year

2002–2017

Publications

Integration of passive and active components into build-up layers

Andreas Ostmann, Alexander Neumann, J. Auersperg et al. · 2002 · 23 citations

Engineering, Device Integration, Computer Architecture +24

Determination of interface fracture parameters by shear testing using different theoretical approaches

R. Dudek, Birgit Bramer, J. Auersperg et al. · 2012 · 20 citations

Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects

J. Auersperg, Matthias Klein, Bernd Michel · 2007 · 20 citations

Utilized Approach, Engineering, Fatigue Aspects +19

Wafer level package using double balls

Michael J. Topper, V. Glaw, P. Coskina et al. · 2002 · 16 citations

Engineering, Industrial Engineering, Computer Architecture +16

SAW sensors for high temperature applications

J.W. Mrosk, C. Ettl, Lothar Berger et al. · 2002 · 13 citations

Engineering, Mechanical Engineering, Acoustic Sensor +18

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