Warren W. Flack

A mathematical model for spin coating of polymer resists

Warren W. Flack, David S. Soong, Alexis T. Bell et al. · Journal of Applied Physics · 1984 · 249 citations

Natural Sciences, Materials Engineering, Materials Science +17

One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging using a Photosensitive Dielectric Material

Warren W. Flack, Robert Hsieh, Ha-Ai Nguyen et al. · 2018 · 22 citations

Engineering, Electrical Engineering, Materials Science +16

One micron redistribution for fan-out wafer level packaging

Warren W. Flack, Robert Hsieh, Ha-Ai Nguyen et al. · 2017 · 19 citations

Engineering, Electrical Engineering, Materials Engineering +13

The optimization and characterization of ultra-thick photoresist films

Warren W. Flack, Warren P. Fan, Sylvia White · Advances in resist technology and processing. Conference · 1998 · 15 citations

Engineering, Materials Engineering, Materials Science +17

<title>Thick photoresist imaging using a three-wavelength exposure stepper</title>

Bradley Todd, Warren W. Flack, Sylvia White · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1999 · 14 citations

Engineering, Materials Engineering, Materials Science +16