E. Andideh

Reactive ion etching of gallium nitride in silicon tetrachloride plasmasa)

I. Adesida, A. Mahajan, E. Andideh et al. · Applied Physics Letters · 1993 · 181 citations

Influence of phonon, geometry, impurity, and grain size on Copper line resistivity

John J. Plombon, E. Andideh, Valery M. Dubin et al. · Applied Physics Letters · 2006 · 150 citations

Engineering, Submicron Copper Lines, Electron Diffraction +19

Interfacial adhesion of copper-low k interconnects

E. Andideh, T. Scherban, Benyuan Sun et al. · 2001 · 56 citations

Engineering, Mechanical Engineering, Interfacial Adhesion +16

Compositional effects on electrical and mechanical properties in carbon-doped oxide dielectric films: Application of Fourier-transform infrared spectroscopy

E. Andideh, Michael M. Lerner, Gerald Palmrose et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2004 · 42 citations

Engineering, Glass Material, Interlayer Dielectrics +21

Nanostructure fabrication in InP and related compounds

I. Adesida, K. Nummila, E. Andideh et al. · Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena · 1990 · 37 citations

Engineering, Electron-beam Lithography, Material Innovation +20