Chun‐Wei Chang

Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints

Cheng‐Hsien Tsai, Wei‐Chen Luo, Chun‐Wei Chang et al. · Journal of Electronic Materials · 2004 · 63 citations

Materials Science, Under-bump Metallurgy, Engineering +11

Functional diversity promotes phytoplankton resource use efficiency

Lin Ye, Chun‐Wei Chang, Shin‐ichiro S. Matsuzaki et al. · Journal of Ecology · 2019 · 58 citations · Full text

Resource Use Efficiency, Biodiversity, Shannon Index +10

Evaluation of counting error due to colony masking in bioaerosol sampling

Chun‐Wei Chang, Yaw‐Huei Hwang, Sergey A. Grinshpun et al. · Applied and Environmental Microbiology · 1994 · 50 citations · Full text

Environmental Monitoring, Engineering, Bioaerosol Sampling +17

Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints

Y. L. Lin, Chun‐Wei Chang, Cheng‐Hsien Tsai et al. · Journal of Electronic Materials · 2006 · 46 citations

Electrical Engineering, Electromigration Technique, Engineering +10

Linking secondary structure of individual size distribution with nonlinear size–trophic level relationship in food webs

Chun‐Wei Chang, Takeshi Miki, Fuh‐Kwo Shiah et al. · Ecology · 2013 · 38 citations · Full text

Trophic Impact, Biodiversity, Biogeochemistry +14