Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints

Recent advances on electromigration in very-large-scale-integration of interconnects

K. N. Tu · Journal of Applied Physics · 2003 · 1.1K citations

Materials Science, Advanced Packaging, Electrical Engineering +15

Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters · 2002 · 361 citations

Electrical Engineering, Electromigration Technique, Engineering +12

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Hua Ye, Cemal Basaran, Douglas C. Hopkins · Applied Physics Letters · 2003 · 242 citations

Engineering, Mechanical Engineering, Electric Current Stressing +19

Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics · 2003 · 231 citations

Engineering, Mean-time-to-failure Study, Solder Bump +18

Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

T. Y. Lee, K. N. Tu, D. R. Frear · Journal of Applied Physics · 2001 · 226 citations

Materials Engineering, Materials Science, Electrical Engineering +15