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Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints

Electrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)Flip-chip Solder JointsHardware ReliabilityResulting Failure MechanismsChip On BoardApplied PhysicsElectromigration-induced Ubm ConsumptionChip AttachmentElectronic PackagingMicroelectronics