Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints - Concepedia

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Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints

63

Citations

30

References

2004

Year

Cheng‐Hsien Tsai, Wei‐Chen Luo, Chun‐Wei Chang, Y. C. Shieh, C. R. Kao

Journal of Electronic Materials

Materials ScienceUnder-bump MetallurgyEngineeringFriction WeldingFlip-chip Solder JointsCorrosionSurface ScienceMechanical EngineeringMetallurgical InteractionChip AttachmentSurface FinishElectronic PackagingMicrostructureMetal Processing

References

	Year	Citations

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