Tony S. Pan

A Mathematical Model of Pattern Dependencies in Cu CMP Processes

Tamba Tugbawa, Duane S. Boning, Tony S. Pan et al. · 1999 · 29 citations

Integration Challenges for CMP of Copper

Rajeev Bajaj, Ajoy Zutshi, Rahul Surana et al. · MRS Bulletin · 2002 · 16 citations

Materials Science, Electrical Engineering, Engineering +6

Process integration of double level copper-low k (k=2.8) interconnect

M. Naik, S. Parikh, P. Li et al. · 2003 · 14 citations

Process Integration, Engineering, Black Diamond +16

Development of a production worthy copper CMP process

K. Wijekoon, Sandeep Kumar Mishra, Stan Tsai et al. · 2002 · 11 citations

Engineering, Industrial Engineering, Mechanical Engineering +17