Concepedia

Wongeol Lee

WL

Statistics

Publications

3

Citations

100

H-Index

3

Active since

2017

Affiliations

Amkor Technology (United States)(Current)

Wongeol Lee is an author at Amkor Technology (United States) specializing in computer engineering, microelectronics, and advanced packaging.

Top concepts

EngineeringMicroelectronicsAdvanced PackagingIntegrated CircuitsComputer EngineeringElectronic PackagingElectrical Engineering3D PrintingHeat Transfer3D Integration

Publications per year

2017–2018

3

Publications

3

Silicon Wafer Integrated Fan-out Technology

Curtis Zwenger, George Scott, Ron Huemoeller et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2017 · 44 citations

Engineering, Device Integration, Mobile Handset +19

Electrical and Thermal Simulation of SWIFT (TM) High-Density Fan-Out PoP Technology

Curtis Zwenger, George Scott, Bora Baloglu et al. · 2017 · 28 citations

Engineering, Liquid Metal Cooling, Mechanical Engineering +20

Chip Stackable, Ultra-thin, High-Flexibility 3D FOWLP (3D SWIFT® Technology) for Hetero-Integrated Advanced 3D WL-SiP

WonMyoung Ki, Wongeol Lee, InSu Mok et al. · 2018 · 28 citations

Engineering, High-flexibility 3D, Computer Architecture +23

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