Concepedia

Bora Baloglu

BB

3

Publications

68

Citations

3

H-Index

2014

Active since

Affiliations

Amkor Technology (United States)(Current)

Bora Baloglu is an author at Amkor Technology (United States) specializing in mechanical engineering, electronic packaging, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMechanical EngineeringComputer EngineeringMaterials Engineering3D PrintingReliabilityHeat Transfer

Publications per year

2014–2017

3

Publications

3

Electrical and Thermal Simulation of SWIFT (TM) High-Density Fan-Out PoP Technology

Curtis Zwenger, George Scott, Bora Baloglu et al. · 2017 · 28 citations

Engineering, Liquid Metal Cooling, Mechanical Engineering +20

SACQ Solder Board Level Reliability Evaluation and Life Prediction Model for Wafer Level Packages

Wei Lin, Quan Pham, Bora Baloglu et al. · 2017 · 22 citations

Wlfo Packages, Life Prediction Model, Engineering +24

Coreless substrate with asymmetric design to improve package warpage

Wei Lin, Bora Baloglu, K. Stratton · 2014 · 18 citations

Engineering, Mechanical Engineering, Package Warpage +16

Rows per page

1–3 of 3