Alok Lohia

Deposition of Nanocomposite Coatings Employing a Hybrid APS + SPPS Technique

Alok Lohia, G. Sivakumar, M. Ramakrishna et al. · Journal of Thermal Spray Technology · 2014 · 27 citations

Materials Science, Thermal Spray Coating, Chemical Engineering +8

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia et al. · Journal of Electronic Packaging · 2010 · 26 citations

Engineering, Mechanical Engineering, Lead-free Solder +21

Failure mechanisms of boards in a thin wafer level chip scale package

Pavan Rajmane, Hassaan Ahmad Khan, Aniruddha Doiphode et al. · 2017 · 18 citations

Pcb Build-up Thickness, Engineering, Mechanical Engineering +20

Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

Unique Rahangdale, Rahul Srinivas, Sumanth Krishnamurthy et al. · 2017 · 14 citations

Engineering, Pcb Thickness, Reliability Engineering +16

Solder ball reliability assessment of WLCSP — Power cycling versus thermal cycling

Unique Rahangdale, Bhavna Conjeevaram, Aniruddha Doiphode et al. · 2017 · 11 citations

Engineering, Energy Efficiency, Reliability Engineering +17