Concepedia

Unique Rahangdale

UR

4

Publications

53

Citations

4

H-Index

2017

Active since

Affiliations

Texas Instruments (United States)(Current)

The University of Texas at Arlington

Unique Rahangdale is an author at Texas Instruments (United States) specializing in electronic packaging, reliability engineering, and reliability.

Top concepts

EngineeringReliabilityElectronic PackagingReliability EngineeringHeat TransferMaterial ScienceMicroelectronicsThermal EngineeringElectrical EngineeringMechanics Of Materials

Publications per year

2017–2017

4

Publications

4

Failure mechanisms of boards in a thin wafer level chip scale package

Pavan Rajmane, Hassaan Ahmad Khan, Aniruddha Doiphode et al. · 2017 · 18 citations

Pcb Build-up Thickness, Engineering, Mechanical Engineering +20

Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

Unique Rahangdale, Rahul Srinivas, Sumanth Krishnamurthy et al. · 2017 · 14 citations

Engineering, Pcb Thickness, Reliability Engineering +16

Solder ball reliability assessment of WLCSP — Power cycling versus thermal cycling

Unique Rahangdale, Bhavna Conjeevaram, Aniruddha Doiphode et al. · 2017 · 11 citations

Engineering, Energy Efficiency, Reliability Engineering +17

Mechanical characterization of RCC and FR4 laminated PCBs and assessment of their board level reliability

Unique Rahangdale, A R Nazmus Sakib, Mugdha Anish Chaudhari et al. · 2017 · 10 citations

Rows per page

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