Aniruddha Doiphode

Publications

Citations

H-Index

2017

Active since

Affiliations

The University of Texas at Arlington(Current)

Aniruddha Doiphode is an author at The University of Texas at Arlington specializing in mechanics of materials, reliability engineering, and electronic packaging.

Top concepts

EngineeringReliabilityMicroelectronicsElectronic PackagingMechanics Of MaterialsReliability EngineeringHeat TransferSolid MechanicsFailure AnalysisMaterial Science

Publications per year

2017–2017

Publications

Failure mechanisms of boards in a thin wafer level chip scale package

Pavan Rajmane, Hassaan Ahmad Khan, Aniruddha Doiphode et al. · 2017 · 18 citations

Pcb Build-up Thickness, Engineering, Mechanical Engineering +20

Solder ball reliability assessment of WLCSP — Power cycling versus thermal cycling

Unique Rahangdale, Bhavna Conjeevaram, Aniruddha Doiphode et al. · 2017 · 11 citations

Engineering, Energy Efficiency, Reliability Engineering +17

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