Pavan Rajmane

Reliability Considerations for Oil Immersion-Cooled Data Centers

Jimil M. Shah, Richard Eiland, Pavan Rajmane et al. · Journal of Electronic Packaging · 2019 · 36 citations

Engineering, Liquid Metal Cooling, Mechanical Engineering +22

Failure mechanisms of boards in a thin wafer level chip scale package

Pavan Rajmane, Hassaan Ahmad Khan, Aniruddha Doiphode et al. · 2017 · 18 citations

Pcb Build-up Thickness, Engineering, Mechanical Engineering +20

Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

Unique Rahangdale, Rahul Srinivas, Sumanth Krishnamurthy et al. · 2017 · 14 citations

Engineering, Pcb Thickness, Reliability Engineering +16

Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages

Shrinath Ramdas, Pavan Rajmane, Tushar Chauhan et al. · 2019 · 14 citations

Engineering, Mechanical Engineering, Immersion Cooling +24

Solder ball reliability assessment of WLCSP — Power cycling versus thermal cycling

Unique Rahangdale, Bhavna Conjeevaram, Aniruddha Doiphode et al. · 2017 · 11 citations

Engineering, Energy Efficiency, Reliability Engineering +17