Pavan Rajmane

Statistics

Publications

Citations

116

H-Index

Active since

2015

Affiliations

The University of Texas at Arlington(Current)

Texas Instruments (United States)

Pavan Rajmane is an author at The University of Texas at Arlington specializing in materials engineering, materials science, and thermal properties of materials.

Publications per year

2015–2019

Publications

Reliability Considerations for Oil Immersion-Cooled Data Centers

Jimil M. Shah, Richard Eiland, Pavan Rajmane et al. · Journal of Electronic Packaging · 2019 · 38 citations

Engineering, Information Technology, Materials Engineering +17

Failure mechanisms of boards in a thin wafer level chip scale package

Pavan Rajmane, Hassaan Ahmad Khan, Aniruddha Doiphode et al. · 2017 · 18 citations

Engineering, Materials Engineering, Materials Science +17

Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

Unique Rahangdale, Rahul Srinivas, Sumanth Krishnamurthy et al. · 2017 · 14 citations

Engineering, Materials Engineering, Materials Science +17

Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages

Shrinath Ramdas, Pavan Rajmane, Tushar Chauhan et al. · 2019 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +17

Solder ball reliability assessment of WLCSP — Power cycling versus thermal cycling

Unique Rahangdale, Bhavna Conjeevaram, Aniruddha Doiphode et al. · 2017 · 11 citations

Engineering, Materials Engineering, Materials Science +17

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